Next-Gen AI Cooling by Stäubli at OCP

The new Mini-QD technology enables the liquid cooling of next-generation optical pluggable modules such as OSFP and QSFP devices that are expected to reach up to 1.6 terabits

Simulation and experimental investigation of liquid-cooling thermal

Abstract This study explores the application of cold plate liquid cooling technology in co-packaged optics (CPO). By integrating optical modules and the switch chip on the same substrate, CPO shortens the

Simulation and experimental investigation of liquid-cooling thermal

Therefore, this paper explores the application of the liquid-cooled cold plate thermal solution in high-capacity CPO systems. Aiming at the heat dissipation requirements of the CPO

People also like:

Get In Touch

Connect With Us

📱

South Africa (Sales)

+27 21 850 1234

🇪🇺

EU Manufacturing Center

+34 936 214 587

📍

Headquarters (Spain)

Avinguda de la Garriga 23, 08830 Sant Boi de Llobregat, Barcelona, Spain